Build reliable, high-performance products- from custom hardware and PCB design to embedded firmware and full product engineering. Whether you're developing an IoT device, industrial system, or telecom solution, we bring the expertise to take it from idea to deployment.
Bootloader, HAL, peripheral drivers. First LED to shell prompt, on your silicon.
Task design, inter-process comms, filesystem, network stack, low-power management.
BLE 5 (mesh, direction-finding), Wi-Fi, LoRaWAN, Thread, Zigbee. Certified profiles.
LTE Cat-M / NB-IoT, connection management, power optimization, MQTT/CoAP.
Trusted boot chain, key management, rollback protection, delta updates, A/B slots.
Yocto/Buildroot distro creation, kernel patches, device tree, systemd services.
On-line ATE scripts, flashing jigs, golden-sample comparison, end-of-line QA.
2 to 16 layers. Impedance-controlled, back-drilled, buried & blind vias where needed.
DDR4, PCIe Gen4, USB 3.2, HDMI, Ethernet. Length-matched, simulated, crosstalk-verified.
Sub-6 GHz matching networks, controlled impedance traces, antenna tuning, shielding.
Wearable and compact-housing designs. Bend-radius analysis, stiffener placement, mech co-design.
High-current paths, thermal relief, star grounding, isolation gaps for creepage/clearance.
Return-path planning, filter placement, ground-plane stitching. We engineer to pass, first try.
BoM scrub, component availability, panelization, test-point coverage, fiducial placement.
In-house SMT + selective solder. 5-day turnaround from gerbers to assembled board.
Power-up sequencing, clock tree verification, thermal profiling, eye-diagram capture.
In-house near-field scanning and conducted emissions. Issues caught before accredited lab.
Thermal cycling, humidity, vibration. Proof your product survives the field — not just the bench.
Concept sketches to production-ready CAD. Injection-mold-ready parts with DFM sign-off.
FCC, CE, BIS, IC, Bluetooth SIG, Wi-Fi Alliance. We project-manage the accredited lab work end-to-end.
EMS selection, PPAP, first-article inspection, yield ramp. On-floor presence during pilot builds.
Fleet management, OTA dashboards, telemetry pipelines. Built on AWS IoT, Azure, or your stack.
Pogo-pin bed-of-nails, functional harnesses, flashing jigs. Cycle-time-optimized for your EMS line.
HIL test benches, regression suites, CI integration. Every commit runs on real hardware.
Per-unit serialization, calibration data, factory acceptance reports. Full product genealogy.
Predictable milestones, senior engineers, transparent pricing. Every program runs on this framework.
Requirements workshop, silicon selection, risk register.
Block diagram, power tree, firmware partitioning, test plan.
Schematic, PCB layout, firmware scaffolding. Weekly reviews.
First-article boards. Bring-up on bench. Characterization.
EMC, thermal, field trials. Design freeze when it's ready.
Factory transfer, yield ramp, warranty support.
Book a 30-minute call with a senior engineer to discuss your custom hardware and embedded systems development needs.